| Project | General process capability | Advanced Process Capability |
| Layout | Through-hole | YES | YES |
| Mechanical blind buried hole | YES | YES |
| Metal substrate | YES | YES |
| High precision 1st order board | 1+N+1 | Rigid-Flex + HDI |
| High precision 2nd stage board | 1+1+N+1+1、2+N+2 |
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| High precision 3rd order board | 1+1+1+N+1+1+1、3+N+3 |
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| Any layer interconnection | Anylayer |
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| Hole | Minimum mechanical drilling | 0.15 | 0.15 |
| Minimum laser drilling | 0.1 | 0.1 |
| Maximum mechanical drilling | 6.5 | 6.5 |
| Minimum slot | 0.5 | 0.5 |
| Minimum copper free hole | 0.8 | 0.5 |
| Hole to hole tolerance | ±0.05 | ±0.05 |
| Through-hole tolerance | ±0.075 | ±0.05 |
| Non sinking copper hole tolerance | ±0.05 | ±0.05 |
| Control drilling depth tolerance | ±0.10 | ±0.05 |
| Maximum aspect ratio of mechanical drill | 10:1 | 15:1 |
| Maximum laser drill aspect ratio | 0.8:1 | 1:1 |
| Through hole to copper | 7mil | 6.5mil |
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| Wiring, solder mask, silk screen printing | Minimum inner line width | 4mil | 3mil |
| Minimum inner line width | 4mil | 3mil |
| Minimum outer line width | 4mil | 3mil |
| Minimum outer line spacing | 4mil | 3mil |
| Line width tolerance | ±20% | ±10% |
| Maximum inner copper thickness | 3/3oz | 4/4oz |
| Maximum outer copper thickness | 3/3oz | 6/6oz |
| IMPEDANCE CONTROL TOLERANCE | ±10% | ±5% |
| Layer to layer deviation<10 layers | ±0.05mm | ±0.038 |
| Layer to layer deviation>10 layers | ±0.075 | ±0.05 |
| Hole to pad | YES |
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| Minimum IC pad size | 0.2 | 0.15 |
| Minimum BGA pad size | 0.23 | 0.2 |
| Solder mask color | Green, white, black, matte black, yellow, red, blue, etc |
| Solder mask alignment | ±0.05mm | ±0.01mm |
| Minimum solder bridge resistance | 3mil | 3mil |
| Screen printing color | White, black, yellow, red, blue, green, gray, etc |
| Minimum character height/width | 0.80mm/0.127mm | 0.5/0.10mm |
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| Mechanical Process | Gong board tolerance | ±0.127mm | ±0.10mm |
| Punch plate tolerance | ±0.20mm | ±0.127mm |
| V-cut position tolerance | ±0.10mm | ±0.075mm |
| Drilling tolerance | ±0.10mm | ±0.05mm |
| Golden finger angle tolerance | 20°/30°/45°、±5° | 20°/30°/45°、±5° |
| Golden finger width tolerance | 1.2±0.20mm | 1.2±0.10mm |
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| Other | Slice report | Yes |
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| Solderability test | Yes |
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| RoHS Declaration Certificate of Conformity | Yes |
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| Ionic contamination testing | Yes |
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| Thickness of nickel and gold | Yes |
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| Impedance Test Report | Yes |
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| Temperature cycling test | Yes |
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| Plate bending and bending | Yes |
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| Surface Treatment | Sinking gold, spraying tin | Yes |
Sometimes we need to add gold fingers |
| Sinking gold+spraying tin | Yes |
| Immersion Tin | Yes |
| Immersion Silver | Yes |
| Lead-free HASL | Yes |
| Gold-plating | Yes |
| Hard gold plating | Yes |
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| Board | Normal Tg, medium Tg, high Tg | Yes |
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| Lead free, halogen-free | Yes |
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| Low dielectric constant plate | Yes |
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| Low loss board | Yes |
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| High frequency laminated board | Yes |
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| PI board, polyimide laminated board | Yes |
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| BT board, BT resin based copper-clad laminate | Yes |
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| Teflon | Yes |
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| Senior | Buried capacitor board | No |
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| Buried resistive board | No |
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| Embedded heat dissipation copper pad | yes |
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| Rigid Flex | yes |
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| Soft hard combination+high precision | yes |
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| Substrate | No |
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| Soft hard combination+metal plate | No |
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| Special process | Silver and gold plating on the edge of the board | yes |
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| Half hole | yes |
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| Lateral aperture | yes |
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| Disk hole | yes |
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| Back drill | yes |
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| Counterbore hole | yes |
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