PCBA

PCBA

PCBA related parameters:

CHIP Minimum Specification (MIL) CHIP Size: 0402 0201

QFP Minimum Pin Spacing (MM) QFP Pin Spacing: 0.40

QFN Minimum Pin Spacing (MM) QFN Pin Spacing: 0.40

Minimum center to center distance of BGA solder balls (mm) BGA Ball Spacing: 0.50 0.40

Component packaging types: tape reel packaging, Tay tray packaging, tube packaging

Type of component package: coil plate, Tay tray package, tube package.


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