Ceramic plate

Ceramic plate

Technical Parameter


MaterialAluminum oxide, aluminum nitride, silicon carbide, silicon nitride, ZTA toughened ceramics
Thickness

0.127mm    0.25mm   0.38mm   0.5mm  0.635mm

  0.76mm  1.0mm  1.5mm  2.0mm  3.0mm

Layer countSingle layer, single-sided, single-layer, double-sided
Copper thickness15-1500um
Surface Treatment

Sinking silver, sinking nickel gold, sinking nickel palladium gold, sinking palladium gold, gold tin alloy, copper palladium gold

Electroplated silver tin deposition

Line width and spacing≥0.05mm
Minimum borehole diameter (mm)0.06mm (conductive hole)
Finished aperture tolerance (mm)0.05mm (plug-in hole)
Profile Tolerance+/-0.05mm 
Minimum distance from circuit to board edge (mm)0.1mm
Finished product thickness tolerance (mm)Finished product thickness tolerance(0.25-0.38mm) ± 0.03mm

Finished product thickness tolerance(0.38-0.635mm)± 0.04mm

Finished product thickness tolerance(0.76-2.00mm)± 0.05mm

Hole toleranceNo copper holes +/-0.05mm There are copper holes+/-0.076mma


Application areas: lighting, sensors, high-power module, high thermal conductivity, radar


Tel: +86 18923884932

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